HEAT SINK AND METHOD FOR PROCESSING ITS SURFACE

PROBLEM TO BE SOLVED: To provide a heat sink and a method for processing its surface, capable of extending only the surface area without varying the volume and at the same time, of improving the heat dissipating performance, by increasing the degree of coarseness of the surface as compared to prior...

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Bibliographic Details
Main Authors REW HO SEON, AN KWANG HYUP, CHUN MUUN KII, LEE JON HO, KIM JONG HOON
Format Patent
LanguageEnglish
Published 10.11.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a heat sink and a method for processing its surface, capable of extending only the surface area without varying the volume and at the same time, of improving the heat dissipating performance, by increasing the degree of coarseness of the surface as compared to prior art. SOLUTION: The heat sink is constituted by of comprising a base 52, attached to a heating element and a heat dissipating pin 54 provided at least one to the base 52, and by forming a number of fine wires 56 on the surface of the base 52 or the heat dissipation pin 54. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050122488