THIN FILM MAGNETIC HEAD, WAFER OF THIN FILM MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY, AND HARD DISK APPARATUS

PROBLEM TO BE SOLVED: To suppress efficiently TPTP by thermal expansion of a coil with simple structure. SOLUTION: In the thin film magnetic head 1, all parts are connected magnetically and mutually through a magnetic connecting part 9, and the head 1 has an upper part magnetic layer 8 and a lower p...

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Bibliographic Details
Main Authors NOGUCHI KIYOSHI, HIRABAYASHI HIROSHI, NARUSHIMA SHIN, OIKE TARO, SAKAMOTO TAKAMITSU
Format Patent
LanguageEnglish
Published 04.11.2005
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To suppress efficiently TPTP by thermal expansion of a coil with simple structure. SOLUTION: In the thin film magnetic head 1, all parts are connected magnetically and mutually through a magnetic connecting part 9, and the head 1 has an upper part magnetic layer 8 and a lower part magnetic layer 6 performing magnetic recording for a recording medium. Also, the head 1 has inside coil conductors 10a of one or two or more which is provided being insulated for the upper part magnetic layer 8 and the lower part magnetic layer 6 between a medium opposing plane ABS opposing to the recording medium between the upper magnetic layer 8 and the lower magnetic layer 6 and the magnetic connecting part 9 and forming one part of the coil respectively. Also, the head 1 has a first thermal expansion absorbing means 13a provided facing at least one of first side planes 14a opposing in the radial direction of the coil 11 of at least one inside coil conductor 10a for absorbing thermal expansion of the inside coil inductor 10a in the radial direction. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040123247