IC TAG, INTERPOSER, CONDUCTIVE BODY-FORMED SHEET WOUND BODY USED FOR IC TAG, INTERPOSER-MOUNTED SHEET WOUND BODY AND MANUFACTURING METHOD OF IC TAG

PROBLEM TO BE SOLVED: To provide an IC tag which enables an interposer to be easily and firmly connected to an antenna circuit and protects an IC chip without additional processing. SOLUTION: An IC tag 1 is provided with an antenna-formed sheet 3 and an interposer 2 arranged on the antenna-formed sh...

Full description

Saved in:
Bibliographic Details
Main Author NAKANISHI YUUKI
Format Patent
LanguageEnglish
Published 04.11.2005
Edition7
Subjects
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SPECIAL PRINTED MATTER
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide an IC tag which enables an interposer to be easily and firmly connected to an antenna circuit and protects an IC chip without additional processing. SOLUTION: An IC tag 1 is provided with an antenna-formed sheet 3 and an interposer 2 arranged on the antenna-formed sheet 3. The antenna-formed sheet 3 comprises a base sheet 20 and an antenna circuit 22. The interposer 2 comprises a supporting sheet 10, a pair of extended electrodes 13 which is arranged on the supporting sheet 10 and coated with a nonconductive bonding agent 17 on its surface not facing the supporting sheet 10, and an IC chip 15. The surface of the interposer 2 on the IC chip 15 side faces the surface of the antenna-formed sheet 3 on the antenna circuit 22 side. The extended electrodes 13 of the interposer 2 are connected to the antenna by caulking, ultrasonic wave bonding, or thermocompression bonding. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040128351