MANUFACTURING METHOD OF IC TAG-MOUNTED SHEET, MANUFACTURING METHOD OF IC TAG, MANUFACTURING DEVICE OF IC TAG, IC CHIP FEEDING METHOD AND IC CHIP FEEDING DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC tag-mounted sheet having a microscopic IC chip on a substrate, and for improving productivity and reducing a production cost. SOLUTION: The method for manufacturing an IC tag-mounted sheet is provided with; a process in which a wafer...

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Bibliographic Details
Main Author NAKANISHI YUUKI
Format Patent
LanguageEnglish
Published 04.11.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC tag-mounted sheet having a microscopic IC chip on a substrate, and for improving productivity and reducing a production cost. SOLUTION: The method for manufacturing an IC tag-mounted sheet is provided with; a process in which a wafer 53 with a adhesive sheet is prepared by bonding a diced wafer 51 comprising many IC chips 15 to an adhesive sheet 52; and a process in which the IC chips 15 are exfoliated from the adhesive sheet 52 by applying ultrasonic waves to the adhesive sheet 52 of the wafer 53 with an adhesive sheet and the exfoliated IC chips are fed into a part feeder 30. The IC chips 15 in the part feeder 30 move up above the substrate 2 while being lined up. Then, the IC chips 15 moved by the part feeder 30 are mounted on the substrate 2. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040122683