COMPOUD, AND COMPOSITION CONTAINING THE SAME
PROBLEM TO BE SOLVED: To provide a compound having a specified structure which can suppress a bloom seen when blending a rubber with resorcinol or a RF (resorcinol-formaldehyde) resin, while maintaining the processability and high wet heat-resistant adherence of a rubber composition when blending th...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
20.10.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a compound having a specified structure which can suppress a bloom seen when blending a rubber with resorcinol or a RF (resorcinol-formaldehyde) resin, while maintaining the processability and high wet heat-resistant adherence of a rubber composition when blending the ruber with it, which can reduce the lowering of adherence during storage of the rubber composition, and which can exhibit superior adhesive stability, and a composition which has the compoud as its main component. SOLUTION: The compound expressed by general formula (1) and the composition having the compound as its main component, are provided. In the formula, R expresses a 1-16C divalent aliphatic group. COPYRIGHT: (C)2006,JPO&NCIPI |
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Bibliography: | Application Number: JP20050069771 |