COMPOUD, AND COMPOSITION CONTAINING THE SAME

PROBLEM TO BE SOLVED: To provide a compound having a specified structure which can suppress a bloom seen when blending a rubber with resorcinol or a RF (resorcinol-formaldehyde) resin, while maintaining the processability and high wet heat-resistant adherence of a rubber composition when blending th...

Full description

Saved in:
Bibliographic Details
Main Authors ARASHIBA NOBUMASA, TSUKAMOTO KAZUYA, KOBAYASHI TAKASHI, NAGATOMO AKINORI, OGAKI KOKI
Format Patent
LanguageEnglish
Published 20.10.2005
Edition7
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a compound having a specified structure which can suppress a bloom seen when blending a rubber with resorcinol or a RF (resorcinol-formaldehyde) resin, while maintaining the processability and high wet heat-resistant adherence of a rubber composition when blending the ruber with it, which can reduce the lowering of adherence during storage of the rubber composition, and which can exhibit superior adhesive stability, and a composition which has the compoud as its main component. SOLUTION: The compound expressed by general formula (1) and the composition having the compound as its main component, are provided. In the formula, R expresses a 1-16C divalent aliphatic group. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050069771