PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM USING THE SAME, METHOD FOR FORMING RESIST PATTERN, PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition of which the flame retardancy can be maintained without using a halogen-based flame retardant, and moreover, which has excellent resolution, electrolytic corrosion resistance and storage stability, and to provide a photosensitive fi...

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Bibliographic Details
Main Authors MORITA MASAKI, HATAKEYAMA SHUICHI
Format Patent
LanguageEnglish
Published 29.09.2005
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition of which the flame retardancy can be maintained without using a halogen-based flame retardant, and moreover, which has excellent resolution, electrolytic corrosion resistance and storage stability, and to provide a photosensitive film using the composition, a method for forming a resist pattern, a printed wiring board and its manufacturing method. SOLUTION: The photosensitive resin composition contains (A) a polymer having a carboxyl group, (B) a photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) a phenoxyphosphazene compound, wherein the content of the (D) component is 30 to 70 parts by weight to total 100 parts by weight of the (A) and (B) components. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040080610