NEW AROMATIC SULFONIUM SALT COMPOUND, PHOTOACID GENERATOR COMPOSED THEREOF, PHOTOPOLYMERIZABLE COMPOSITION CONTAINING THE SAME, RESIN COMPOSITION FOR OPTICAL SOLID-FORMING USE AND OPTICAL SOLID-FORMING METHOD

PROBLEM TO BE SOLVED: To provide a new compound useful as a good photopolymerization initiator efficiently absorbing the light of a light source and quickly giving a cured product having good quality, a photoacid generator composed of the compound, a photopolymerizable composition containing the gen...

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Bibliographic Details
Main Authors NAKAYASHIKI AKIKAZU, TACHIKAWA HIROYUKI
Format Patent
LanguageEnglish
Published 29.09.2005
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a new compound useful as a good photopolymerization initiator efficiently absorbing the light of a light source and quickly giving a cured product having good quality, a photoacid generator composed of the compound, a photopolymerizable composition containing the generator, a resin composition for optical solid-forming use and an optical solid-forming method using the composition. SOLUTION: The new aromatic sulfonium salt compound is expressed by general formula (I). The aromatic sulfonium salt compound is activated by the absorption of efficient long-wavelength light and acts as an excellent photoacid generator. The photopolymerizable composition containing the compound is quickly curable to form a cured product having good properties and, accordingly, the photoresist composed of the photopolymerizable composition has high sensitivity and high resolution. The use of a resin composition for optical solid-forming use containing the aromatic sulfonium salt compound provides an optical solid-forming method effective for eliminating the defects of conventional technique, preventing the inhibition of curing with oxygen, improving the precision in curing, giving small excess cured part, easily giving a formed product having a desired dimension, having high sensitivity to irradiation energy, giving sufficient cured depth and free from delamination trouble. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20050042020