RESIN SEAL DEVICE AND RESIN SEAL METHOD

• Main Author: MIURA MUNEO
• Format: Patent
• Language: English
• Published: 22.09.2005
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To prevent resin burr from being produced between the pot block and upper mold in sealing electronic components with resin, protecting the substrate and eliminating the need for disc spring adjustment. SOLUTION: A pattern 1 is provided with a pot block 9 and a substrate block 5, a pot block 9 is spring-supported with a coil spring 21 in a way that it can slide for the substrate block 5, the upper mold 2 is provided with a pin 24 in a way that it can be moved horizontally, and a substrate 16 on the substrate block 5 is pressed by the pin 24 against the pot block 9 with an adequate pressure before completion of clamping the upper mold 2 and pattern 1. In clamped state, the substrate 16 is also held between the upper mold 2 and substrate block 5 with an adequate clamp pressure, and the pot block 9 is pressed against the upper mold 2 with an adequate pressure through a coil spring 21. In unclamped state, the pot block 9 is raised while sliding along the substrate block 5 because the coil spring 21 extends. COPYRIGHT: (C)2005,JPO&NCIPI