SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent adverse effect on heat dissipation characteristics as much as possible even if a solder joint is broken by thermal stress in a semiconductor device where heat sinks are solder jointed to the surface side and the rear surface side of a semiconductor chip and then they...

Full description

Saved in:
Bibliographic Details
Main Authors HIRANO NAOHIKO, MASAMITSU KUNIAKI
Format Patent
LanguageEnglish
Published 08.09.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To prevent adverse effect on heat dissipation characteristics as much as possible even if a solder joint is broken by thermal stress in a semiconductor device where heat sinks are solder jointed to the surface side and the rear surface side of a semiconductor chip and then they are resin molded. SOLUTION: The semiconductor device S1 comprises first and second semiconductor chips 11 and 12, a lower heat sink 20 bonded to the rear surface side of the semiconductor chips 11 and 12 through first solder 51, an upper heat sink 30 bonded to the surface side of the semiconductor chips 11 and 12 through second solder 52, and mold resin 60 sealing both heat sinks 20 and 30 and the semiconductor chips 11 and 12 to wrap in wherein the surface of the semiconductor chips 11 and 12 serves as an element forming surface. Among solder joints by solders 51, 52 and 53, strain value caused by thermal stress of the first solder 51 is highest. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040291397