DEVICE AND METHOD FOR POLISHING SEMICONDUCTOR WAFER

• Main Authors: KON SHINICHI, SUZUKI TAKAYUKI, HIRANO YOSHIHIRO, FUJIYAMA KATSURA
• Format: Patent
• Language: English
• Published: 08.09.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide polishing device/method in polishing of a semiconductor wafer, without enlarging the device and with suppression of cost, and with which work efficiency can be improved. SOLUTION: In the method, the semiconductor wafer stored in a box is conveyed to a polishing part 2 by a conveyance means so as to polish it, a temporary storage box 12, which temporarily stores the wafer before polishing is previously installed in a loader part 10; a box 11, where the wafer W to be polished is stored, is disposed in the loader; a part of the wafers W in the box is transferred to the polishing part, and polishing is started; all the wafers left in the box are transferred to the temporary storage box during polishing of the wafer. The box which becomes empty is exchanged with the next box where the new wafer is stored; and when polishing of the wafer is terminated, the wafer transferred to the temporary storing box is conveyed to the polishing part, and the next polishing is performed. COPYRIGHT: (C)2005,JPO&NCIPI