MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

• Main Authors: KAWAHARA TOSHISANE, ITO DAISUKE
• Format: Patent
• Language: English
• Published: 08.09.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To enable proper inspection without damaging an inspection device when inspecting electrical characteristics or the like of a semiconductor device manufactured by processing at a wafer level, and without exerting a bad influence on good semiconductor devices. SOLUTION: A manufacturing method of a semiconductor device for manufacturing a semiconductor device with processing of a wafer level applies a processing of forming a circuit such as an ordinary rewiring pattern for a semiconductor chip judged to be good, on the basis of an inspection result for individual semiconductor chip constituting a semiconductor wafer 10 upon forming a semiconductor device at a wafer level. Alternatively, for semiconductor chips judged to be bad it applies a processing of not forming a rewiring pattern in order to avoid a bad influence on an inspection device or a good semiconductor device in inspection or the like after the semiconductor device is formed. COPYRIGHT: (C)2005,JPO&NCIPI