PRINTED BOARD, ELECTRONIC CIRCUIT SUBSTRATE, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a printed board and an electronic circuit board having electronic components mounted thereon which relaxes stresses caused in the electronic components or connecting points when a bending stress is applied to the printed board. SOLUTION: The electronic circuit board...

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Bibliographic Details
Main Authors MATSUNAGA TOSHIHIRO, KAMIGAI YASUMI
Format Patent
LanguageEnglish
Published 02.09.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a printed board and an electronic circuit board having electronic components mounted thereon which relaxes stresses caused in the electronic components or connecting points when a bending stress is applied to the printed board. SOLUTION: The electronic circuit board mounts a semiconductor element 2 on a printed board 1 having a specified wiring pattern not shown. The semiconductor element 2 is electrically connected to the specified region of the wiring pattern with a solder connection part 3. The printed board 1 has recessed trenches 4 opened on the surface having the wiring pattern formed thereon in the vicinity of a wiring pattern region connectable with the semiconductor element 2. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040042791