SOLAR CELL MODULE

PROBLEM TO BE SOLVED: To solve the problem of a solar cell module that when it is used outdoors over a long term of 10 years or more, a stress is applied to the part of connection wiring and bonding wiring due to temperature cycle and crack or fracture takes place at that part to cause lowering of o...

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Bibliographic Details
Main Author TSUGE TAKASHI
Format Patent
LanguageEnglish
Published 11.08.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To solve the problem of a solar cell module that when it is used outdoors over a long term of 10 years or more, a stress is applied to the part of connection wiring and bonding wiring due to temperature cycle and crack or fracture takes place at that part to cause lowering of output. SOLUTION: In the connection wiring of a solar cell module, low melting point eutectic solder is used at the soldering part of a solar cell element and the connection wiring. The occurrence of warpage is substantially eliminated which is caused after soldering due to difference of thermal expansion coefficient between the connection wiring and the solar cell element. Furthermore, solder substantially containing no lead having high creep strength is used at the soldering part of the bonding wiring and the connection wiring. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040022275