HEATING AND COOLING APPARATUS

• Main Authors: OGAWARA YOSHIO, SATO TOSHIHIRO
• Format: Patent
• Language: English
• Published: 04.08.2005
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To reduce the frequency of apparatus maintenance by swiftly heating and cooling to a temperature required by a load. SOLUTION: A heating and cooling apparatus 2 uses a medium capable of heating to a heating limit temperature of 200°C or higher and cooling to 0°C or lower in a liquid phase state. A heating medium circulation circuit C3 includes a heater 24 for heating the medium to a temperature higher than a heating set temperature required by the load W, supplies a heated medium to the load W through a third supply flow path 26 and returns the medium supplied to the load W through a forth return flow path 37. A cooling medium circulation circuit C2 includes a cooler 14 for cooling the medium to a temperature lower than a cooling set temperature required by the load W, and returns the medium supplied to the load W through a fifth return flow path 38. In response to the requirement of the load W, the circulation circuits C2 and C3 are switched to heat and cool the load W. COPYRIGHT: (C)2005,JPO&NCIPI