SAW DEVICE, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a SAW device in which a position to mount a cover is stabilized, there is no defective article, and productivity is improved, and which is inexpensive, and also to provide its manufacturing method. SOLUTION: In a SAW device of the present invention, any one of an upp...

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Bibliographic Details
Main Authors TAKAGUCHI YASUSHI, WAKITA YASUMICHI
Format Patent
LanguageEnglish
Published 07.07.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a SAW device in which a position to mount a cover is stabilized, there is no defective article, and productivity is improved, and which is inexpensive, and also to provide its manufacturing method. SOLUTION: In a SAW device of the present invention, any one of an upper surface of a side wall 3 and a cover 13 comprises a plurality of recessed portions 8 and the other of the upper surface of the side wall 3 and the cover 13 comprises a plurality of projecting portions 14. The cover is positioned relatively to a substrate member 1 by fitting the recessed portions 8 and the projecting portions 14 with each other, so that the SAW device is obtained in which the position to mount the cover 13 is stabilized, no dispersion occurs in the position to mount the cover 13, and there is no defective article. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030426088