METHOD OF FORMING METAL PATTERN WITH LOW RESISTANCE
PROBLEM TO BE SOLVED: To provide a method of forming metal patterns which is capable of forming a single or multi layers quickly and effectively by simple manufacture processes without the necessity of such additional processes as a process for forming a metal thin film requiring high vacuum and hig...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
07.07.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a method of forming metal patterns which is capable of forming a single or multi layers quickly and effectively by simple manufacture processes without the necessity of such additional processes as a process for forming a metal thin film requiring high vacuum and high temperature conditions or an exposure process for forming a fine pattern and a subsequent etching process, and also to provide a flat type display device manufactured by the same. SOLUTION: A method of forming a metal pattern, comprising the steps of: (i) coating a photocatalytic compound onto a substrate to form a photocatalytic film; (ii) coating a water-soluble polymer compound on the photocatalyst film to form a water-soluble polymer layer; (iii) selectively exposing the photocatalytic film and the water-soluble polymer layer to form a latent pattern acting as a nucleus for crystal growth; and (iv) plating the latent pattern of the nucleus for crystal growth to grow metal crystals thereon, thereby forming a metal pattern. COPYRIGHT: (C)2005,JPO&NCIPI |
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Bibliography: | Application Number: JP20040363143 |