PIEZOELECTRIC VIBRATOR HOUSING PACKAGE AND PIEZOELECTRIC DEVICE
PROBLEM TO BE SOLVED: To provide a piezoelectric vibrator housing package capable of electrically and mechanically excellently connecting an electrode of a piezoelectric vibrator to an upper metallize layer with high positional accuracy even if the piezoelectric vibrator housing package becomes more...
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Main Author | |
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Format | Patent |
Language | English |
Published |
16.06.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a piezoelectric vibrator housing package capable of electrically and mechanically excellently connecting an electrode of a piezoelectric vibrator to an upper metallize layer with high positional accuracy even if the piezoelectric vibrator housing package becomes more small-sized and thinner, and a highly reliable piezoelectric device using this piezoelectric vibrator housing package. SOLUTION: The piezoelectric vibrator housing package comprises an insulating substrate 3 including a recess 2 for housing a piezoelectric vibrator 1 on its upper principal surface, and a step 6 which is formed in a corner on the base of the recess 2 and composed of an upper metallize layer 4 and a lower metallize layer 5 and in which a terminal portion of a lower surface of the planar piezoelectric vibrator 1 is mounted on an upper surface of the upper metallize layer 4, the upper metallize layer 4 being formed while partially covering the lower metallize layer 5 in a plane view and being expanded outward from the lower metallize layer 5. COPYRIGHT: (C)2005,JPO&NCIPI |
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Bibliography: | Application Number: JP20040046667 |