WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board that omits a process of removing reverse-surface resin flowing out to a build-up body formation surface of a core substrate when a method of filling a through hole of a cavity of the wiring board having the build-up body on o...

Full description

Saved in:
Bibliographic Details
Main Author OTA SUMIO
Format Patent
LanguageEnglish
Published 16.06.2005
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

Be the first to leave a comment!
You must be logged in first