WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board that omits a process of removing reverse-surface resin flowing out to a build-up body formation surface of a core substrate when a method of filling a through hole of a cavity of the wiring board having the build-up body on o...

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Bibliographic Details
Main Author OTA SUMIO
Format Patent
LanguageEnglish
Published 16.06.2005
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board that omits a process of removing reverse-surface resin flowing out to a build-up body formation surface of a core substrate when a method of filling a through hole of a cavity of the wiring board having the build-up body on one surface with the reverse-surface resin is employed, and the wiring board using the same. SOLUTION: The wiring board which has the build-up body on the 1st main top surface of the core substrate has a reverse-surface insulating layer formed by depositing a compound material containing a thermosetting material on the 2nd main top surface of the core substrate, has the through hole, formed in the core substrate, filled with a compound material of the same kind with the reverse-surface insulating layer, and further has a 1st insulating layer formed by depositing a compound material of the same kind on the 1st main top surface. Then the remaining build-up body is formed on the 1st main top surface, and the 1st insulating layer is less in film thickness than the reverse-surface insulating layer. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030398593