ULTRASONIC FLIP-CHIP BONDING STRUCTURE AND CONNECTING METHOD

PROBLEM TO BE SOLVED: To provide an ultrasonic flip-chip bonding structure damaging no electrical connectability by the filling of an underfill resin. SOLUTION: A partitioning member 46 surrounding so as to partition a second region 48 is formed in a first region 47 partitioned by a plurality of bum...

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Bibliographic Details
Main Authors KITAOKA KOKI, SAKOTA NAOKI
Format Patent
LanguageEnglish
Published 16.06.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an ultrasonic flip-chip bonding structure damaging no electrical connectability by the filling of an underfill resin. SOLUTION: A partitioning member 46 surrounding so as to partition a second region 48 is formed in a first region 47 partitioned by a plurality of bump electrodes 42 on a surface 49, on which the bump electrodes 42 for a semiconductor element 41 are formed. The surface of the semiconductor element in the second region 48 surrounded by the partitioning member 46 is coated previously with the first underfill resin 45a. The bump-electrode forming surface 49 of the semiconductor element 41 and the electrode-pad forming surfaced 50 of a wiring board 43 are opposed. The bump electrodes 42 and the electrode pads 44 are abutted, and ultrasonic flip-chip bonded by applying a load and ultrasonic vibrations. An ultrasonic flip-chip bonding structure 40 is obtained by filling a second underfill resin 45b. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030391040