TIN ALLOY ELECTROPLATING METHOD

• Main Authors: NISHIKAWA TETSUJI, HAGA MASAKI, OBATA KEIGO
• Format: Patent
• Language: English
• Published: 02.06.2005
• Edition: 7
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To smoothly prevent the substitutive deposition on the anode and the increase in tin ion concentration in a plating bath regarding a tin alloy electroplating method. SOLUTION: In the tin alloy electroplating method where an alloy of tin and a metal nobler than tin is electrodeposited, an anode chamber is separated from a plating tank via an anion exchange membrane, the anode using tin as the material is provided in the anode chamber, a tinning liquid, acid or the salt thereof is stored inside the anode chamber, the tin alloy plating liquid is stored inside the plating tank, and electroplating is performed. Since the metal nobler than tin and the anode are separated by the anion exchange membrane which does not allow cations to permeate, the migration of the noble metal cations are blocked by the anion exchange membrane, and the substitutive deposition of the noble metal at the anode can be prevented. Further, it is possible to block the migration of the tin ions to the side of the cathode by using the anion exchange membrane and eliminate an increase in the concentration of tin in the plating bath. COPYRIGHT: (C)2005,JPO&NCIPI