PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE SAME AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a pattern forming method which has a favorable photosensitive characteristics and which conducts a photosensitive resin composition having favorable curing resin characteristics abundant in unconventional flexibility, and a pattern layer having the favorable cured re...

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Bibliographic Details
Main Authors KOMATSU HIROSHI, OE TADAYUKI
Format Patent
LanguageEnglish
Published 26.05.2005
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:PROBLEM TO BE SOLVED: To provide a pattern forming method which has a favorable photosensitive characteristics and which conducts a photosensitive resin composition having favorable curing resin characteristics abundant in unconventional flexibility, and a pattern layer having the favorable cured resin characteristics by using this photosensitive resin composition, not by conventional organic solvent phenomenon but by inexpensive alkali water solution; and to provide a semiconductor device having the favorable cured resin characteristics as a buffer coat membrane, inter-layer insulating membrane or the like. SOLUTION: A composition is used as a photosensitive resin composition which includes a polymer ingredient (A) consists of a heat resistance polymer having an acid functional group or its inductive substituent, or of its precursor; a photo-reactive compound (B) having an amid bonding at a main skeleton part and generates acid by photo-reaction; and solvent (C). COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030372247