POLYAMIDE FOAM AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide various polyamide moldings reduced in weight by using a polyamide low in water absorption and excellent in heat resistance, chemical resistance, slidability, creep resistance, rigidity, and toughness. SOLUTION: The polyamide foam is constituted of a polyamide compris...

Full description

Saved in:
Bibliographic Details
Main Authors UCHIDA KOICHI, MUNESAWA YUJI
Format Patent
LanguageEnglish
Published 26.05.2005
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide various polyamide moldings reduced in weight by using a polyamide low in water absorption and excellent in heat resistance, chemical resistance, slidability, creep resistance, rigidity, and toughness. SOLUTION: The polyamide foam is constituted of a polyamide comprising a dicarboxylic acid unit (a) containing a naphtalenedicarboxylic acid unit of 50-100 mol% and a diamine unit (b) containing a 1,9-nonanediamine unit and/or 2-methyl-1,8-otanediamine unit of 50-100 mol%, and has an expansion ratio of 1.01-1.25 and a foam size of ≤200 μm. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030369999