ELECTRONIC PART MOUNTING DEVICE AND ELECTRONIC PART MOUNTING METHOD

• Main Author: ARIKADO KAZUO
• Format: Patent
• Language: English
• Published: 12.05.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an electronic part mounting device and an electronic part mounting method which can cope with two embodiments of die bonding and flip chip bonding by the same device. SOLUTION: In an electronic part mounting device, electronic parts supplied to a part supply part 10...