ELECTRONIC PART MOUNTING DEVICE AND ELECTRONIC PART MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide an electronic part mounting device and an electronic part mounting method which can cope with two embodiments of die bonding and flip chip bonding by the same device. SOLUTION: In an electronic part mounting device, electronic parts supplied to a part supply part 10...

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Bibliographic Details
Main Author ARIKADO KAZUO
Format Patent
LanguageEnglish
Published 12.05.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an electronic part mounting device and an electronic part mounting method which can cope with two embodiments of die bonding and flip chip bonding by the same device. SOLUTION: In an electronic part mounting device, electronic parts supplied to a part supply part 10 in a face-up state are taken out to be mounted on a board 3. A flip chip 13 supplied by a first holding table 11A is taken out by a take-up head 9 and is transferred to a mounting head 4 in an upside-down state to be mounted on the board 3. A die 14 supplied by a second holding table 11B is directly picked up by the mounting head 4 to be mounted on the board 3. Thus, it is possible to cope with two embodiments of die bonding and flip chip bonding by the same device. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040334148