CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

• Main Authors: TSUBOMATSU YOSHIAKI, WAKABAYASHI AKIHIKO, NAMATAME KAZUHIKO, TAMURA TADASHI
• Format: Patent
• Language: English
• Published: 12.05.2005
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a circuit board which does not require any plated metal for covering a non-through hole filled up with an insulating resin and on which a minute circuit can be formed, and to provide a method of manufacturing the circuit board. SOLUTION: The circuit board comprises an internal board which has a plated non-through hole 1 having an inside diameter of ΦI, an internal conductor layer which is provided in the opening of the non-through hole 1 and has a diameter of ΦL, and an insulating resin layer formed on the surface of the internal conductor layer. The circuit board also comprises another non-through hole 2 which is formed in the insulating resin layer to reach the internal conductor layer immediately above the non-through hole 1 and has an opened diameter of ΦO. The non-through hole 1 having the inside diameter of ΦI is filled up with an insulating resin. The circuit board has one or more connecting hole structures in which the non-through hole 1 having the inside diameter of ΦI, the internal conductor layer having the diameter of ΦL, and the non-through hole 2 having the opened diameter of ΦO are formed by adjusting a relation among the diameters ΦI, ΦL, and ΦO to ΦI<ΦO<ΦL. COPYRIGHT: (C)2005,JPO&NCIPI