MIRROR POLISHING DEVICE OF WAFER NOTCH

PROBLEM TO BE SOLVED: To prevent generation of a visually different area in a surface state by a whisker-like body; and to remove the whisker-like body without substantially having influence on polishing work time of a notch of a semiconductor wafer, in a mirror polishing device of a wafer notch. SO...

Full description

Saved in:
Bibliographic Details
Main Authors TAKAHASHI SATOSHI, ENARI AKITOSHI, HAKOMORI SHUNJI, FURUSAWA SHIRO
Format Patent
LanguageEnglish
Published 12.05.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To prevent generation of a visually different area in a surface state by a whisker-like body; and to remove the whisker-like body without substantially having influence on polishing work time of a notch of a semiconductor wafer, in a mirror polishing device of a wafer notch. SOLUTION: Whisker removing tools 7 and 7' capable of removing the whisker-like body M generated in a polishing tool 211, are arranged on the opposite side of a wafer support surface of a tiltable wafer chuck table 6. Whiskers are removed by pressing the polishing tool 211 to the whisker removing tools 7 and 7' by predetermined force by tilting the wafer chuck table 6 at a whisker removing angle β outside of a range of a tile angle for polishing the notch. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030353901