HIGH PRESSURE PROCESSOR AND HIGH PRESSURE PROCESSING METHOD

• Main Authors: YAMAGATA MASAHIRO, MURAOKA YUSUKE, IWATA TOMOMI, INOUE YOICHI, OSHIBA HISANORI, SAITO KIMITSUGU
• Format: Patent
• Language: English
• Published: 28.04.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; CONTROLLING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PHYSICS; PREVENTION OF FOULING IN GENERAL; REGULATING; SEMICONDUCTOR DEVICES; SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES; TRANSPORTING

PROBLEM TO BE SOLVED: To do structure simplification and cost reduction for a high pressure processor and a high pressure processing method that performs specified surface treatment by bringing processing fluid into contact with the surface of an object to be processed, the processing fluid prepared by mixing high pressure fluid and all or some of agents of two or more kinds. SOLUTION: The high pressure processor has mixing vessels 6A and 6B that temporarily store agents A and B, respectively. The respective mixing vessels 6A and 6B are connected to a high pressure fluid supply unit 2. When a mixture (processing fluid) of the agent A and SCF is used to do surface treatment, SCF is pressed from the high pressure fluid supply unit 2 to the mixing vessel 6A where the agent A is stored in advance, and the agent A is dissolved by the SCF that flows into the mixing vessel 6A, thus producing a mixture (processing fluid) of the agent A and the SCF. Further, a high pressure valve (processing fluid injection valve) 39 is opened to feed the processing fluid into the pressure vessel 1. Thus, the processing fluid is used to carry out the specified surface treatment onto the substrate arranged in the pressure vessel 1. COPYRIGHT: (C)2005,JPO&NCIPI