PREPREG, MANUFACTURING METHOD THEREOF AND LAMINATED PLATE

• Main Authors: MATSUIDE DAISUKE, KIMURA YASUYUKI
• Format: Patent
• Language: English
• Published: 21.04.2005
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a prepreg which inhibits the increase in voids in a substrate, the melt viscosity rise in the prepreg and the bad influence on a copper foil while improving such lowering of a thermal expansion coefficient and such elevating of an elastic modulus under the environment of high temperatures as required for a printed wiring board and which is excellent in the productivity of laminated plates. SOLUTION: The prepreg is inside the glass cloth yarn bundle arranged with inorganic particles having an average particle diameter of from 1 nm to 100 nm, is outside the glass cloth yarn bundle arranged with inorganic particles having an average particle diameter of 500 nm to 5,000 nm, and besides is on the surface layer of the glass cloth yarn bundle arranged with inorganic particles having an average particle diameter of from more than the average particle diameter of the inorganic particles inside the glass cloth yarn bundle to less than the average particle diameter of the inorganic particles outside the glass cloth yarn bundle. COPYRIGHT: (C)2005,JPO&NCIPI