METHOD AND APPARATUS FOR CUTTING LAMINATED GLASS

• Main Authors: JIBIKI SATOSHI, FURUSAWA MASAAKI
• Format: Patent
• Language: English
• Published: 21.04.2005
• Edition: 7
• Subjects: CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; GLASS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To provide a method and an apparatus for cutting laminated glass which enable the laminated glass to efficiently be cut into a prescribed size. SOLUTION: In the cutting method, the laminated glass 10 is set on the glass cutting apparatus 20 and a YAG laser oscillation unit for irradiating an intermediate film comprising film-like polyvinyl butylal (PVB) with laser beam having 1,064 nm wave length (λ) and 15 J/cm2energy density is moved in the X direction or the Y direction (biaxial direction) at a speed of 300 mm/sec until the temperature of the intermediate film reaches equal to or above the vaporization temperature and a wheel cutter is moved at the same speed in the same direction as that of the YAG laser oscillation unit to press the outside surface of the glass. In this stage, a vertical crack is produced on the outside surface of the glass and then the laminated glass 10 is broken manually to be cut. COPYRIGHT: (C)2005,JPO&NCIPI