POLISHING PAD FOR ELECTROCHEMICAL MECHANICAL POLISHING

• Main Authors: JAMES DAVID B, ROBERTS JOHN V H, COOK LEE MELBOURNE
• Format: Patent
• Language: English
• Published: 14.04.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To obtain a current density and electric field which the conventional polishing pad has been short of. SOLUTION: In order to provide a polishing pad 4 for electrochemical mechanical polishing of a conductive substrate, the pad includes a plurality of grooves 24 which are formed...