POLISHING PAD FOR ELECTROCHEMICAL MECHANICAL POLISHING

PROBLEM TO BE SOLVED: To obtain a current density and electric field which the conventional polishing pad has been short of. SOLUTION: In order to provide a polishing pad 4 for electrochemical mechanical polishing of a conductive substrate, the pad includes a plurality of grooves 24 which are formed...

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Bibliographic Details
Main Authors JAMES DAVID B, ROBERTS JOHN V H, COOK LEE MELBOURNE
Format Patent
LanguageEnglish
Published 14.04.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To obtain a current density and electric field which the conventional polishing pad has been short of. SOLUTION: In order to provide a polishing pad 4 for electrochemical mechanical polishing of a conductive substrate, the pad includes a plurality of grooves 24 which are formed on the polishing surface of the polishing pad and adapted to facilitate the fluidity of polishing fluid on the polishing pad. Conductive layers 26 are respectively formed in grooves and electrically coupled to each other. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040249454