MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board for an interposer in which the accuracy in the thickness of an insulating layer is high, also the characteristic impedance of a transmission line is stabilized, the excellent adhesion reliability under a high temperature and high hum...

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Bibliographic Details
Main Authors MORINO MORIO, KAWAHARA KEIZO, MAEDA SATOSHI, YOSHIDA TAKESHI
Format Patent
LanguageEnglish
Published 14.04.2005
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board for an interposer in which the accuracy in the thickness of an insulating layer is high, also the characteristic impedance of a transmission line is stabilized, the excellent adhesion reliability under a high temperature and high humidity is also contained after a temperature cycle is applied, a difference in a coefficient of line expansion relative to a semiconductor chip is small, and the connection reliability in mounting a bare chip is high. SOLUTION: As a substrate, a film composed of polyimide obtained by reacting aromatic diamines having a benzo oxazole structure with aromatic tetracarboxylic anhydrides is used, and as an adhesive composition, a resin composition having nitrilebutadiene rubber having nitrile content of 25-50 wt% and an epoxy resin containing two or more epoxy groups per molecule as essential components is used. The multilayer printed wiring board is produced with a build-up structure or a one-shot lamination structure to be used as the interposer. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030333076