MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE, AND OPTICAL SWITCHING DEVICE

• Main Authors: HARADA HIROSHI, FUKUSHIMA HIROSHI, NOGE HIROSHI, USHIYAMA NAOKI, OKA NAOMASA, JOMI HIROTAKA, YOSHIHARA TAKAAKI, SUZUKI YUJI
• Format: Patent
• Language: English
• Published: 14.04.2005
• Edition: 7
• Subjects: MICROSTRUCTURAL TECHNOLOGY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

PROBLEM TO BE SOLVED: To prevent side etching at both longitudinal ends of a plate-like structure to carry out integration. SOLUTION: A semiconductor substrate (a silicon substrate) is wet-etched to form the plate-like structure with the side faces formed as (111) faces almost perpendicular to the m...