MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE, AND OPTICAL SWITCHING DEVICE

PROBLEM TO BE SOLVED: To prevent side etching at both longitudinal ends of a plate-like structure to carry out integration. SOLUTION: A semiconductor substrate (a silicon substrate) is wet-etched to form the plate-like structure with the side faces formed as (111) faces almost perpendicular to the m...

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Bibliographic Details
Main Authors HARADA HIROSHI, FUKUSHIMA HIROSHI, NOGE HIROSHI, USHIYAMA NAOKI, OKA NAOMASA, JOMI HIROTAKA, YOSHIHARA TAKAAKI, SUZUKI YUJI
Format Patent
LanguageEnglish
Published 14.04.2005
Edition7
Subjects
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