MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE, AND OPTICAL SWITCHING DEVICE

PROBLEM TO BE SOLVED: To prevent side etching at both longitudinal ends of a plate-like structure to carry out integration. SOLUTION: A semiconductor substrate (a silicon substrate) is wet-etched to form the plate-like structure with the side faces formed as (111) faces almost perpendicular to the m...

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Main Authors HARADA HIROSHI, FUKUSHIMA HIROSHI, NOGE HIROSHI, USHIYAMA NAOKI, OKA NAOMASA, JOMI HIROTAKA, YOSHIHARA TAKAAKI, SUZUKI YUJI
Format Patent
LanguageEnglish
Published 14.04.2005
Edition7
Subjects
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To prevent side etching at both longitudinal ends of a plate-like structure to carry out integration. SOLUTION: A semiconductor substrate (a silicon substrate) is wet-etched to form the plate-like structure with the side faces formed as (111) faces almost perpendicular to the main surface of the substrate. At this time, etching is performed to form compensation parts 22 at both longitudinal ends of the plate-like structure. The compensation part is composed of an extended part 23 extending each end of the plate-like structure, and a (111) face structure part 24 extending in a (111) face direction intersecting the plate-like structure. Side etching occurs at the (111) face structure part. There is therefore no need to take side etching into consideration when setting the length of the plate-like structure. The formed plate-like structure is used as a mirror in an optical switching device. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030331135