MULTILAYER PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board for an interposer of which the precision in the thickness of an insulating layer is high, the characteristic impedance of a transfer line is stable, bonding reliability is good even after a temperature cycle is applied at a high tem...

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Bibliographic Details
Main Authors MORINO MORIO, KAWAHARA KEIZO, MAEDA SATOSHI, YOSHIDA TAKESHI
Format Patent
LanguageEnglish
Published 07.04.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board for an interposer of which the precision in the thickness of an insulating layer is high, the characteristic impedance of a transfer line is stable, bonding reliability is good even after a temperature cycle is applied at a high temperature and high humidity, a linear expansion factor difference form a semiconductor chip is small, and connection reliability at bare chip mounting is high. SOLUTION: A film formed of a polyimide which is acquired through reaction between aromatic diamines having a benzo oxazole structure and aromatic tetracarboxylic anhydrides is used as a base material. A bonding resin composition comprising polyester-polyurethane having an acid value of specific number average molecular weight and an epoxy resin containing at least two epoxy radical per one molecule as main components is used, to manufacture a multilayer printed circuit board with a buildup structure or a collective lamination structure which is used as an interposer. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030328419