DRESSING WHEEL AND DRESSING METHOD FOR GRINDING MEMBER

PROBLEM TO BE SOLVED: To provide a dressing wheel capable of eliminating the need for a dedicated dressing apparatus in conventional wafer chamfering equipment. SOLUTION: This dressing wheel 1 used for dressing a grinding member for chamfering a thin disc-shaped wafer is composed of a thin disc-shap...

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Bibliographic Details
Main Authors KAMIKAWA KENJI, ONISHI YOSHIHIRO
Format Patent
LanguageEnglish
Published 31.03.2005
Edition7
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a dressing wheel capable of eliminating the need for a dedicated dressing apparatus in conventional wafer chamfering equipment. SOLUTION: This dressing wheel 1 used for dressing a grinding member for chamfering a thin disc-shaped wafer is composed of a thin disc-shaped base member 2 and an abrasive grain section 3 provided on the outer-periphery end of the base member 2 and formed into a roughly same shape as a workpiece. The base member 2 is formed of, for example, an aluminum alloy, and the abrasive grain section uses a diamond formed by electrodeposition. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030317972