BOARD-TO-BOARD ELECTRODE JOINTING METHOD AND STRUCTURE
PROBLEM TO BE SOLVED: To provide a method for jointing board-to-board electrodes which stably keeps electrical conduction, and also to provide a structure composed by carrying out that kind of jointing. SOLUTION: In this board-to-board electrode jointing method, conductor electrode parts 6 and 8 hav...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
24.03.2005
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| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | PROBLEM TO BE SOLVED: To provide a method for jointing board-to-board electrodes which stably keeps electrical conduction, and also to provide a structure composed by carrying out that kind of jointing. SOLUTION: In this board-to-board electrode jointing method, conductor electrode parts 6 and 8 having projecting parts 8 are formed on one-side board 2; conductor electrode parts 5 and 7 having recessed parts 9 are formed on the other-side board 1; thereafter the one-side board 2 and the other-side board 1 are faced with each other; and the projecting parts 8 are inserted into the recessed parts 9 and a load is applied to the boards 1 and 2, whereby the insertion parts are plastically deformed to joint them to each other. COPYRIGHT: (C)2005,JPO&NCIPI |
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| AbstractList | PROBLEM TO BE SOLVED: To provide a method for jointing board-to-board electrodes which stably keeps electrical conduction, and also to provide a structure composed by carrying out that kind of jointing. SOLUTION: In this board-to-board electrode jointing method, conductor electrode parts 6 and 8 having projecting parts 8 are formed on one-side board 2; conductor electrode parts 5 and 7 having recessed parts 9 are formed on the other-side board 1; thereafter the one-side board 2 and the other-side board 1 are faced with each other; and the projecting parts 8 are inserted into the recessed parts 9 and a load is applied to the boards 1 and 2, whereby the insertion parts are plastically deformed to joint them to each other. COPYRIGHT: (C)2005,JPO&NCIPI |
| Author | ONO HARUTO AKAIKE MASATAKE |
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| Notes | Application Number: JP20030312087 |
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| Snippet | PROBLEM TO BE SOLVED: To provide a method for jointing board-to-board electrodes which stably keeps electrical conduction, and also to provide a structure... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS SEMICONDUCTOR DEVICES |
| Title | BOARD-TO-BOARD ELECTRODE JOINTING METHOD AND STRUCTURE |
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