BOARD-TO-BOARD ELECTRODE JOINTING METHOD AND STRUCTURE

PROBLEM TO BE SOLVED: To provide a method for jointing board-to-board electrodes which stably keeps electrical conduction, and also to provide a structure composed by carrying out that kind of jointing. SOLUTION: In this board-to-board electrode jointing method, conductor electrode parts 6 and 8 hav...

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Bibliographic Details
Main Authors AKAIKE MASATAKE, ONO HARUTO
Format Patent
LanguageEnglish
Published 24.03.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method for jointing board-to-board electrodes which stably keeps electrical conduction, and also to provide a structure composed by carrying out that kind of jointing. SOLUTION: In this board-to-board electrode jointing method, conductor electrode parts 6 and 8 having projecting parts 8 are formed on one-side board 2; conductor electrode parts 5 and 7 having recessed parts 9 are formed on the other-side board 1; thereafter the one-side board 2 and the other-side board 1 are faced with each other; and the projecting parts 8 are inserted into the recessed parts 9 and a load is applied to the boards 1 and 2, whereby the insertion parts are plastically deformed to joint them to each other. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030312087