SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

• Main Authors: HATAZAWA AKIHIKO, KUSANAGI YOSHITOMO, KAGAYA YUTAKA, KIKUCHI TAKAYA
• Format: Patent
• Language: English
• Published: 17.03.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To cope with the increase in the number of signals by standardizing a substrate which is subjected to lamination packaging of a semiconductor chip. SOLUTION: In a semiconductor device wherein a plurality of substrates with a semiconductor chip mounted are laminated, one end of...