SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

• Main Authors: HATAZAWA AKIHIKO, KUSANAGI YOSHITOMO, KAGAYA YUTAKA, KIKUCHI TAKAYA
• Format: Patent
• Language: English
• Published: 17.03.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To cope with the increase in the number of signals by standardizing a substrate which is subjected to lamination packaging of a semiconductor chip. SOLUTION: In a semiconductor device wherein a plurality of substrates with a semiconductor chip mounted are laminated, one end of a lead formed in the substrate is connected to a semiconductor chip and the other end thereof is a connection terminal of the substrate. At least a part of the lead is branched to a plurality near a connection terminal, and the branched leads are different connection terminals. The manufacturing method has a process for carrying out piece assembly for mounting a semiconductor chip on the substrate, a process for selecting a non-defective item with the semiconductor chip mounted on the substrate, a process for performing discrete dicing treatment for the substrate of each layer, while keeping conduction of a prescribed lead from the branched lead and a process for laminating and packaging the discrete substrate in a specified order. According to this constitution, it is possible to standardize a substrate of the same pattern and to switch many signals, since it has enough space. COPYRIGHT: (C)2005,JPO&NCIPI