DEVICE FOR PACKAGING ELECTRONIC COMPONENT

• Main Authors: SAITO MASARU, MOROOKA HIROAKI, HACHIMAN NAOYUKI, OGURA YUTAKA, ANZAI HIROSHI
• Format: Patent
• Language: English
• Published: 17.03.2005
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; PHYSICS; PRINTED CIRCUITS; TESTING

PROBLEM TO BE SOLVED: To provide an electronic component packaging device for efficiently and precisely imaging and recognizing a plurality of electronic components, and for accurately packaging components. SOLUTION: The images of components 9A, 9B sucked by suction nozzles 6A, 6B are guided into the visual field of a recognition camera 7 via first optical systems (5b, 5a), and are imaged by the cameras by optimizing each illumination condition. Additionally, the images of components 9C, 9D sucked by other suction nozzles 6C, 6D are guided into the visual field of the recognition camera via second optical systems (5d, 5c, 5a), and are imaged by the camera by optimizing each illumination condition. The image of a component imaged via each optical system is captured successively for processing, and the suction deviation of each component is recognized. In this configuration, imaging is made successively by the number of times corresponding the number of components, and imaging is made under optimum illumination conditions for each component, so that each component can be imaged under optimum conditions quickly and accurately. COPYRIGHT: (C)2005,JPO&NCIPI