BLADE OF ROBOT FOR HANDLING SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To guarantee that no defective wafer will be produced due to the fact that the deterioration of the blade of a robot handling semiconductor wafer may result in generation of defective particles, and that they may be embedded into semiconductor wafer being handled or may fall on...

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Bibliographic Details
Main Author GARCIA JR MARTIN B
Format Patent
LanguageEnglish
Published 10.03.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To guarantee that no defective wafer will be produced due to the fact that the deterioration of the blade of a robot handling semiconductor wafer may result in generation of defective particles, and that they may be embedded into semiconductor wafer being handled or may fall on the lower part of the semiconductor wafer. SOLUTION: According to an embodiment, a system (100) for handling semiconductor wafer (110) is equipped with a chamber (102), a robot (130) related to the chamber, and the blade (200) of the robot jointed to the robot at a first edge, that is in general, arranged horizontally in the chamber. The blade of the robot includes the first edge to a remote second edge, and this second edge has a planar view contour forming continuously curved surface. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040233465