MARKER STRUCTURE FOR ALIGNMENT OR OVERLAY TO CORRECT PATTERN INDUCED DISPLACEMENT, MASK PATTERN TO DEFINE THE MARKER STRUCTURE, AND LITHOGRAPHIC PROJECTING APPARATUS USING THE MASK PATTERN
PROBLEM TO BE SOLVED: To provide a mask pattern for imaging a marker structure which decreases lens aberration and influences of the limitation of projection in a lithographic process. SOLUTION: The mask pattern is formed to image a marker structure on a substrate by lithographic projection. The mar...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
03.02.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a mask pattern for imaging a marker structure which decreases lens aberration and influences of the limitation of projection in a lithographic process. SOLUTION: The mask pattern is formed to image a marker structure on a substrate by lithographic projection. The marker structure is constituted to determine the optical alignment or overlay in use and has a constituent part defining the marker structure. The constituent part is segmented into a plurality of segmented elements (EL; ML), each segmented element having substantially a size of a device feature. In the mask pattern having a segment shape for each segmented element (EL; ML), the mask pattern for the marker structure includes at least one assist feature (EL_sub) located at a critical part of the segment shape for suppressing optical aberration or optical limitation generated in the lithographic projection at the critical part. At least one assist feature (EL_sub) substantially has a size below the resolution of the lithographic projection. COPYRIGHT: (C)2005,JPO&NCIPI |
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Bibliography: | Application Number: JP20040202539 |