SEPARATION METHOD AND SEPARATION APPARATUS
PROBLEM TO BE SOLVED: To provide a method capable of exactly separating a mixture of product after plating treatment and a dummy used at the plating treatment to the respective parts and preventing a bonding dummy from being mixed to the product even when the bonding dummy is contained in the mixtur...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
27.01.2005
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To provide a method capable of exactly separating a mixture of product after plating treatment and a dummy used at the plating treatment to the respective parts and preventing a bonding dummy from being mixed to the product even when the bonding dummy is contained in the mixture. SOLUTION: Of the mixture of the product C fed onto a first separation plate 11, the dummy D1 and the bonding dummy D2, the product C forming a prism and the bonding dummy D2 are moved so as to ascend the first separation plate 11 and are dropped off on a second separation plate 12. The dummy D1 forming a spherical shape is moved so as to descend on the first separation plate 11 and is dropped off on a fourth separation plate 14. Subsequently, the product C dropped off on the second separation plate 12 is moved so as to ascend the second separation plate 12 and is dropped off from a rear end of the second separation plate 12. The bonding dummy D2 dropped off on the second separation plate 12 is moved so as to descend on the second separation plate 12 having an inclination angle θ12 larger than the inclination angle θ11 of the first separation plate 11 and is dropped off on a third separation plate 13. COPYRIGHT: (C)2005,JPO&NCIPI |
---|---|
Bibliography: | Application Number: JP20030187766 |