APPARATUS AND METHOD FOR EVALUATING ELECTROSTATIC DAMAGE

• Main Authors: YAMAGUCHI MINEO, NARITA KENJI
• Format: Patent
• Language: English
• Published: 24.12.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To evaluate electrostatic damage on the way of a process, and to know the presence or absence of electrostatic discharge breakdown and an electrostatic breakdown voltage value. SOLUTION: The apparatus for evaluating the electrostatic damage includes a supporting stand 1001 for holding a semiconductor substrate 1003, a mechanism 1002 for rotating the supporting stand 1001, a mechanism for discharging insulating liquid to the semiconductor substrate 1003, and a current measuring means 1008 connected to the supporting stand 1001. The surface of the substrate is charged by the friction of the semiconductor substrate 1003 and the insulating liquid, a current flowing from the supporting stand 1001 by this charging is measured by the current measuring means 1008, and thereby the electrostatic damage can be evaluated. Thus, the insulating liquid is discharged to an insulating film on the surface of the substrate and a semiconductor integrated circuit structure while the semiconductor substrate 1003 rotates, the surface is accurately charged, and hence the electrostatic damage caused in an actual semiconductor manufacturing process or the insulating withstand voltage of the film between multilayer wirings can be evaluated at a wafer level. COPYRIGHT: (C)2005,JPO&NCIPI