METHOD OF SEALING PACKAGE FOR ELECTRONIC PART

• Main Author: SAKURAI MITSUMASA
• Format: Patent
• Language: English
• Published: 24.12.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of sealing by an electron beam capable of realizing a reduction of size of a package for electronic parts. SOLUTION: The method of selling the package for the electronic part includes a step of placing a lid 1 on the outer peripheral frame of a ceramic case 2 for housing the electronic part via a brazing material, imparting the electronic beam in a vacuum atmosphere along the peripheral edge of the lead, melting the brazing material and fixing the lid to the ceramic case. The method also includes a first step of irradiating the periphery of the lid exposed from the opening of a tool with the electron beam, by bringing the lid into pressure close contact with the outer peripheral frame of the ceramic case by a first tool having an opening at a part of the position corresponding to the outer peripheral frame of the ceramic case; and a second step of irradiating the peripheral edge of the lid exposed from the opening of the tool with the electron beam, by bringing the lid into pressure close contact with the outer peripheral frame of the ceramic case by a second tool having an opening corresponding to the peripheral edge of the lit not irradiated with the electron beam in the first step. COPYRIGHT: (C)2005,JPO&NCIPI