PACKAGE FOR ENCASING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

• Main Author: ICHIMARU HIROYUKI
• Format: Patent
• Language: English
• Published: 16.12.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a package for encasing a semiconductor element capable of permitting the miniaturization of the package and improving the air tightness of the same while transmitting a signal well by reducing the size in the lengthwise direction of an input-output terminal. SOLUTION: The package for encasing the semiconductor element is provided with a first flat plate unit 3a consisting of a ceramics on the upper surface of which a first line conductor 11 is formed, and a second flat plate unit 3b formed of a ceramics laminated on the first flat plate unit 3a with a second line conductor 12 formed thereon. The second line conductor 12 is extended from one side of the upper surface of first flat plate unit 3a toward the other side of the same so as to be parallel to the first line conductor 11, and so as not to be superposed on the first line conductor 11 in up-and-down direction while being extended downward on the half way of extension of the same. The second line conductor 12 is extended to the side of the other side of the first flat plate unit 3a, a first lead terminal 5a is connected to one end of the first line conductor 11 while a second lead terminal 5b is connected to one end of the second line conductor 12, and the second lead terminal 5b is provided with the input-output terminal 3 shorter than the first lead terminal 5a. COPYRIGHT: (C)2005,JPO&NCIPI