MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To realize low radiation noise of a multilayer printed wiring board without damaging high-density property of an electronic apparatus. SOLUTION: The multilayer printed wiring board is provided with a ground, a signal layer, a power source wiring pattern which is wired in the si...

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Bibliographic Details
Main Author SEKIGUCHI KIYOSHI
Format Patent
LanguageEnglish
Published 16.12.2004
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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