MULTILAYER PRINTED WIRING BOARD
PROBLEM TO BE SOLVED: To realize low radiation noise of a multilayer printed wiring board without damaging high-density property of an electronic apparatus. SOLUTION: The multilayer printed wiring board is provided with a ground, a signal layer, a power source wiring pattern which is wired in the si...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
16.12.2004
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!