MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To realize low radiation noise of a multilayer printed wiring board without damaging high-density property of an electronic apparatus. SOLUTION: The multilayer printed wiring board is provided with a ground, a signal layer, a power source wiring pattern which is wired in the si...

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Bibliographic Details
Main Author SEKIGUCHI KIYOSHI
Format Patent
LanguageEnglish
Published 16.12.2004
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To realize low radiation noise of a multilayer printed wiring board without damaging high-density property of an electronic apparatus. SOLUTION: The multilayer printed wiring board is provided with a ground, a signal layer, a power source wiring pattern which is wired in the signal layer, and interlayer insulating layers which are arranged between the respective layers. High dielectric constant material is interposed in a part which has the same shape with the power source wiring pattern of the interlayer insulating layer between the power source wiring pattern and the ground where a layer adjoins. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030150194